세라믹 정전척 (Ceramic ESC)
High Performance Long life-time Hybrid Electrostatic Chuck Uniformity Flatness Durability

Aegisco’s Hybrid ESC represents an advancement in Ceramic ESC technology, integrating Johnsen-Rahbek and Coulomb forces to deliver higher performance and greater durability than traditional Ceramic ESC.

Ceramic ESC

Hybrid Type

Bonding Technology
High Performance
Fast Release Time
Long Life-time

Hybrid ESC

Performance
  • High-strength Chucking
  • Fast De-chucking
  • Temperature Uniformity
  • Long life-time
Materials
  • High-density Ceramic
  • Highest breakdown voltage strength
  • Embedded thin heater
Design
  • He Groove / Mesa
  • Surface Embossing
  • Minimizing He Leak
Specifications
Model Name JB-A-001 JW-Z-001 CI-A-001 SW-T-001
Color Black White Ivory White
Dimensions Dielectric Material Thickness 1 ~ 3T 1 ~ 2T 1T 0.15 ~ 0.5T
Wafer Size Compatibility ≤ 12”
Operating Temperature -20 °C to 100 °C
Operating Voltage ~ 3 kV DC ~ 3 kV DC ~ 5 kV DC ~ 3 kV DC
Chucking Force ≤ 20 gf/㎠ ≤ 20 gf/㎠ ≤ 10 gf/㎠ ≤ 30 gf/㎠
Surface Flatness ≥ 20 ㎛
Surface Roughness (Ra) ≥ 0.1 ㎛ -
Ceramic Characteristics Compressive Strength ≥ 1,000 Mpa ≥ 1,000 Mpa ≥ 1,000 Mpa ≥ 1,000 Mpa
Heat Shock Strength ≥ △ 200 ℃ ≥ △ 200 ℃ ≥ △ 200 ℃ ≥ △ 100 ℃
Applications Etching / Inspecting / Measurement / Packaging Process in Semiconductor
Figures
According to Surface Roughness
According to Thickness
Comparison with J-R and Coulomb